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Linde Nippon Sanso

Etching Gases

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Silicon Germanium (SiGe)

Wafer manufacturing

Silicon tetrafluoride 4.8


	Purity, %	> 99,998


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O₂		3
N₂		3
CO		3
CO₂		3
CH₄		10
The percentages indicated in conjuction with purities are mole percents (ideal volume percentages)

Delivery forms: Silicon tetrafluoride 4.8
	Capacity, liter	filling pressure, approx. bar	filling quantity, kg
Steel cylinder	2	18	0,2
Steel cylinder	10	18	1
Steel cylinder	50	63	22,7
Steel cylinder	50	18	5

Conversion factors Silicon tetrafluoride

m³ gas (15 °C, 1 bar)	Litre liquid at T_s	kg
1	2,643	4,388
0,378	1	1,66
0,228	0,602	1

Identification Silicon tetrafluoride 4.8
Cylinder shoulder color:	Yellow RAL 1018
Label:	Silicon tetrafluoride 4.8
Valve outlet:	1, DIN 477 No. 8

Properties Silicon tetrafluoride
Compressed gas, caustic, toxic
MAK value:	0.8 ppm (TLV)
Chemical symbol:	SiF₄
Molar mass:	104.08 g/mol
Critical temperature:	259 K (-14.15 °C)
Sublimation temperature on 1,013 bar:	177.95 K (-95.2 °C)
Relative density at 15°C, 1 bar (dryair = 1):	3.626

Applications Silicon tetrafluoride 4.8

deposition of fluorinated silicon oxide
ion implantation
dry etching of semiconductor materials

Mixtures of Silicon tetrafluoride with other gases in defined compositions.

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